2850-90-334 Power supply, and analogue and digital circuit principles and fault(Assignment)

CITY & GUILDS - LEVEL 3 - DIPLOMA IN ELECTRICAL & ELECTRONIC ENGINEERING (2850-90)


  • Explain the operation of law voltage dc power regulator circuits.
  • Explain the key components ,and the operation of ,a switch mode power supply (SMPS)
  • Evaluate the advantages and disadvantages of SMPS compared with series and shunt regulator circuits.
  • Explain principles of fault location in power supply circuits.
  • Explain the operation of single and multi -stage bipolar transistor voltage amplifiers.
  • Explain the different classes and models of operation of bipolar transistor circuits.
  • Explain how to obtain response plots for amplifier circuits.
  • Explain the operation of MOSFET amplifier , transistorised power amplifier and operational amplifier circuits.
  • Explain the meaning of common terms relating to operational amplifiers.
  • State the conditions for oscillation in amplifier circuits.
  • Explain the operation of common oscillation circuits and 555 timer circuits.
  • Apply falult location to component level using appropriate test instruments.
  • Classify common logic device encapsulations.
  • Explain common terms used with digital electronics.
  • Classify and compare devices in logic families.
  • Explain the operation of logic devices to produce counting and dividing circuits.
  • Explain the operation of synchronous and asynchronous integrated counters.
  • Explain the effects of mechanical switch/ relay cotact bounce on logic circuits.
  • Explain the principles of Time Division Multiplexing (TDM)
  • Critically compare digital encoding methods employed in data transmission systems.
  • Critically compare tranmission medium for data transmission employing TDM.
  • Explain error detection and correction techniques employed in digital systems.
  • Connect bitable logic devices to produce counting and dividing circuits
  • Assemble, test and find faults on digital circuits.
  • Explain common causes of failure of integrated circuits (IC's) during use and serving.
  • Explain methods for preventing IC damage by electroctatic discharge during assembly/servicing.
  • Explain the uses and limitations of test equipment in relation to logic circuits.
  • Explain fault finding techniques.
  • SUBJECT INTRODUCTION By Lecturer